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DATE : | May 2nd, 2012 @ 4:30-6:00PM | ABSTRACT: | The semiconductor industry is facing some major changes. The Moore's Law that the Industry has undergone for the last 40 years is getting to some insurmountable barriers. One possibility to continue the race is the new concept "more than Moore" that put some of the effort into the back end-Packaging, namely 3D packaging and TSV (Through Silicon Vias). We will cover this new exciting technology, the problems, the issues and the future possibilities. For more information, please refer to an article HERE. |
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VENUE : | Nixon Peabody -2 Palo Alto Square 3000 El Camino | |||||||
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